Localization of dielectric breakdown defects in multilayer ceramic capacitors using 3D X-ray imaging
Ingman, Jonny; Jormanainen, Joni; Vulli, Aleksi; Ingman, Jimmy; Maula, Kari; Kärkkäinen, Tommi; Silventoinen, Pertti (2018)
Post-print / Final draft
Ingman, Jonny
Jormanainen, Joni
Vulli, Aleksi
Ingman, Jimmy
Maula, Kari
Kärkkäinen, Tommi
Silventoinen, Pertti
2018
Journal of the European Ceramic Society
2019
Elsevier
School of Energy Systems
Kaikki oikeudet pidätetään.
© Elsevier
© Elsevier
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi-fe2018092736730
https://urn.fi/URN:NBN:fi-fe2018092736730
Tiivistelmä
In this article, a non-destructive method using 3D X-ray imaging to find dielectric breakdowndefects in multilayer ceramic capacitors (MLCCs) aged by high temperature and high voltage in an accelerated test is presented. In total, 64 aged samples were investigated using 2D X-ray imaging and half of them were further analysed with 3D X-ray imaging. Miniscule dielectric breakdown defects located in the MLCC active region are extremely difficult to identify solely using cross-section analysis or 2D X-ray imaging. In this study, the information provided by the 3D X-ray analysis was used to localize the defects for cross-section analysis. Cross-section analysis was performed to verify the dielectric breakdowns and their locations. 3D X-ray imaging is an effective method for detecting dielectric breakdown defects in MLCCs due to its short analysis time and high accuracy. This further facilitates failure analysis processes by providing the required grinding depth in cross-section analysis procedures.
Lähdeviite
Ingman, J.M., Jormanainen, J.P.A., Vulli, A.M., Ingman, J.D., Maula, K., Kärkkäinen, T.J., Silventoinen, P. (2018). Localization of dielectric breakdown defects in multilayer ceramic capacitors using 3D X-ray imaging. Journal of the European Ceramic Society. DOI:10.1016/j.jeurceramsoc.2018.10.030
Alkuperäinen verkko-osoite
https://www.sciencedirect.com/science/article/pii/S0955221918306617?via%3DihubKokoelmat
- Tieteelliset julkaisut [1523]