Modeling of magnetic field distribution and optimization of a magnetron for magnetron sputtering technology

Abstract

Current work focuses on applications of computer simulations for design optimization of a magnetron sputtering source. In order to perform the optimization, a program was written that allows to model all stages of magnetron sputtering: calculation of magnetic field depending on the magnetron geometry, simulation of a magnetron discharge, and simulation of sputtering and deposition of atoms. Use of these simulations allows to optimize parameters of a magnetron for a more effective target material usage, and choose the best parameters for deposition of films with given uniformity with the least possible target material waste.