Evaluation of failure mechanisms in electronics using X-ray imaging
Ingman, Jonny Mikael (2022-09-30)
Väitöskirja
30.09.2022
Lappeenranta-Lahti University of Technology LUT
Acta Universitatis Lappeenrantaensis
School of Energy Systems
School of Energy Systems, Sähkötekniikka
Kaikki oikeudet pidätetään.
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In reference to IEEE copyrighted material which is used with permission in this thesis, the IEEE does not endorse any of Lappeenranta-Lahti University of Technology LUT's products or services. Internal or personal use of this material is permitted. If interested in reprinting/republishing IEEE copyrighted material for advertising or promotional purposes or for creating new collective works for resale or redistribution, please go to http://www.ieee.org/publications_ standards/publications/rights/rights_link.html to learn how to obtain a License from RightsLink.
Julkaisun pysyvä osoite on
https://urn.fi/URN:ISBN:978-952-335-851-5
https://urn.fi/URN:ISBN:978-952-335-851-5
Tiivistelmä
Multilayer ceramic capacitors and thick film resistors are widely used in electronic circuits for frequency converters because of their small size and volumetric efficiency. In addition, as a result of the current trend of miniaturization in electronics, these components have become more vulnerable to different failure mechanisms. In a critical application, a failure in a multilayer ceramic capacitor or a thick film resistor may cause a complete functional breakdown of a device or a system. By understanding the physics of the failure of these components, higher reliability can be achieved by lifetime modelling and more robust component design in critical locations.
In this doctoral dissertation, an industrial radiographic inspection method was used to determine the internal condition of an electronic component that had been subjected to stress in reliability testing. Four different reliability test setups were constructed, and the failure signature in the components was analysed by 2D and 3D X-ray imaging methods. Furthermore, destructive analysis methods were employed to verify the observed failure mechanisms in 2D and 3D X-ray imaging.
The results presented in this doctoral dissertation verify the possibility to use 2D and 3D X-ray imaging methods in electronic component reliability testing. As a result, failures induced mechanically, electrically, and chemically were identified.
In this doctoral dissertation, an industrial radiographic inspection method was used to determine the internal condition of an electronic component that had been subjected to stress in reliability testing. Four different reliability test setups were constructed, and the failure signature in the components was analysed by 2D and 3D X-ray imaging methods. Furthermore, destructive analysis methods were employed to verify the observed failure mechanisms in 2D and 3D X-ray imaging.
The results presented in this doctoral dissertation verify the possibility to use 2D and 3D X-ray imaging methods in electronic component reliability testing. As a result, failures induced mechanically, electrically, and chemically were identified.
Kokoelmat
- Väitöskirjat [1102]