CMS pixel detector testing system for the Phase-2 upgrade production
Cao, Wei (2022)
Diplomityö
2022
School of Engineering Science, Laskennallinen tekniikka
Kaikki oikeudet pidätetään.
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi-fe2022121270674
https://urn.fi/URN:NBN:fi-fe2022121270674
Tiivistelmä
The HL-LHC upgrade requires improvements in the radiation hardness of the innerl tracker pixel sensor and provides an opportunity to leverage silicon fabrication technology improvements.
This work focuses on the research of the setup process for testing the ROC based on Centos 8.0, the calibration of the preliminary linear part of the RD53A readout chip and briefly introduces the difference between the RD53A and RD53B chips.
The RD53A is the first iteration of a new readout chip co-developed by the RD53 collaboration for the second phase upgrade of CMS and ATLAS experiments. The chip has 3 different front-end flavors to test: synchronous, linear and differential. Calibration was done by using X-ray fluorescence and charge injection of several metals. The RD53B is a second-generation chip that analyzes many of the known flaws in the RD53A design, including higher-than-expected timing variation of charge injection pulses from column to column.
This work focuses on the research of the setup process for testing the ROC based on Centos 8.0, the calibration of the preliminary linear part of the RD53A readout chip and briefly introduces the difference between the RD53A and RD53B chips.
The RD53A is the first iteration of a new readout chip co-developed by the RD53 collaboration for the second phase upgrade of CMS and ATLAS experiments. The chip has 3 different front-end flavors to test: synchronous, linear and differential. Calibration was done by using X-ray fluorescence and charge injection of several metals. The RD53B is a second-generation chip that analyzes many of the known flaws in the RD53A design, including higher-than-expected timing variation of charge injection pulses from column to column.