Development of a hybrid semiconductor-compression refrigeration system for high-precision temperature control with PID optimization

Abstract

I have explored a compressor-semiconductor hybrid refrigeration system to address the issues of high energy consumption, slow response times, and poor temperature control accuracy in traditional single-mode refrigeration systems. First, I proposed a fully integrated solution that seamlessly combines multi-stage thermoelectric chips with low-power reciprocating piston compressors, multi-layer insulated structures, and a water-cooled and air-cooled composite heat dissipation system. The hardware components include Arduino and C51 microcontrollers, MOS drivers, and DS18B20 sensors to enable real-time temperature data acquisition and staged control. The software includes a discreet PID algorithm and a two-stage control strategy, where the compressor rapidly pre-cools at large temperature differences, and the thermoelectric module finely regulates at small temperature differences. MATLAB multi-physics simulation results show that the system can reduce the internal temperature from 300 K to 213 K within 160 seconds. This study provides a novel refrigeration solution for applications such as pharmaceutical cold chains and precision instruments.