Microchannel liquid cooling : a next-generation thermal management solution for power electronic converters

Abstract

With the rapid development of power electronic converters, their power density continues to increase, which presents significant thermal management challenges. Traditional air cooling methods are often unable to effectively maintain optimal operating temperatures in high-performance applications. Liquid cooling technology is a promising solution that offers superior thermal performance, improved efficiency and enhanced reliability. This innovative technology is receiving a lot of attention for its potential to address heat restriction and support miniaturization and sustainability of power electronic systems. Research in this area is critical for optimizing design, fluid selection, and integration strategies to advance the next generation of converters. Microchannel is a new generation liquid cooling technology with great development potential. In this thesis, COMSOL6.1 software is used for modeling and simulation, coupling fluid mechanics with heat transfer physical field, and finding the best heat dissipation model by comparing and analyzing the heat dissipation effect of each model.