The effects of vibration on defective solder joints
Kaltz, Emilia (2025)
Kandidaatintyö
2025
School of Energy Systems, Sähkötekniikka
Kaikki oikeudet pidätetään.
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi-fe2025052855418
https://urn.fi/URN:NBN:fi-fe2025052855418
Tiivistelmä
Vibration testing is important in electronics to predict how different components and solder joints behave under stress. In different operating environments, such as vehicles and machines, electronics are exposed to vibration. With vibration testing the endurance of these components is tested. It is essential to know the time frame in which parts should be replaced or repaired to make sure that they function properly. Especially, when solder joints are made manually, there is significant potential for defects. Examples for common defects are an inappropriate amount of solder or not using the optimal temperature to solder.
The aim of this thesis is to examine the effect of vibration on solder joints, that have been soldered with a wrong temperature profile. For this purpose, a circuit board is designed and ordered. The defective solder joints are then soldered, and after vibration testing with the DYN-PM-100 electrodynamic shaker, the structure of the solder joints is examined with CT scanning.
The results show that if the soldering temperature is low and close to the melting point of the solder, some of the solder doesn’t melt completely and the solder joints become very porous. There are more problems caused in a defective solder joint which has been subjected to vibration than there is in a correct solder joint, as the vibration can cause voids and cracks and the components are more likely to break off than in correct solder joints.
The aim of this thesis is to examine the effect of vibration on solder joints, that have been soldered with a wrong temperature profile. For this purpose, a circuit board is designed and ordered. The defective solder joints are then soldered, and after vibration testing with the DYN-PM-100 electrodynamic shaker, the structure of the solder joints is examined with CT scanning.
The results show that if the soldering temperature is low and close to the melting point of the solder, some of the solder doesn’t melt completely and the solder joints become very porous. There are more problems caused in a defective solder joint which has been subjected to vibration than there is in a correct solder joint, as the vibration can cause voids and cracks and the components are more likely to break off than in correct solder joints.